Omkar G Karhade

This inventor holds 119 USPTO granted patents and 94 published patent applications and 4 EPO patents, primarily in Microelectronic Packaging (CPC class H01L24-16). Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2015-2026.

USPTO Granted Patents = 119 (Patent Applications = 94)

% Patents Active = 90.8

EPO Patents = 4 (Patent Applications = 24)

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 201(Granted Patents)

Forward Citations (Not Self Cited) = 160(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

Years Active: 2015-2026

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Areas of Expertise:

Microelectronic Structures

Photonic Integrated Circuits

Ultra-Thin Packages

Through Substrate Vias

Die Attach Connections

Optical Interconnections

High Bandwidth Memory

Cavity Designs

Embedded Lasers

Thermal Stabilization

Wafer Stack Architecture

Heat Dissipation

119 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12745642 - Device, method, and system to mitigate warpage of a composite chiplet (2026-09-22),

2. 12740476 - Package architecture with vertical stacking of integrated circuit dies having planarized edges and multi-side routing (2026-09-15),

3. 12713924 - DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A COMPOSITE CHIPLET (2026-08-18),

4. 12702044 - Substrate trench for improved hybrid bonding (2026-08-04),

5. 12696801 - Package architecture with compute bricks having vertically stacked dies (2026-07-28),

6. 12681243 - Thermal structure for a micro-ring resonator (MRR) in a photonic integrated circuit (PIC) (2026-07-14),

7. 12672566 - Wireless chip-to-chip high-speed data transport (2026-06-30),

8. 12669658 - Photonic integrated circuit packaging architectures (2026-06-30),

9. 12669644 - Designs of thermal insulation for micro-ring resonator (MRR) in on-cavity pic (OCPIC) to achieve effective thermal tuning (2026-06-30),

10. 12667006 - Integrated circuit packages with hybrid bonded dies and methods of manufacturing the same (2026-06-23),

11. 12656558 - Photonic integrated circuit packaging architectures (2026-06-16),

12. 12599050 - Multi-level die coupled with a substrate (2026-04-07),

13. 12599034 - Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer (2026-04-07),

14. 12599007 - Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias (2026-04-07),

15. 12591092 - Covered cavity for a photonic integrated circuit (PIC) (2026-03-31),

Title: The Innovative Journey of Omkar G Karhade

Introduction

Omkar G Karhade, based in Chandler, AZ, has made significant strides in the realm of technology with an impressive portfolio of 71 patents. His inventive contributions span various fields, showcasing his expertise and commitment to innovation.

Latest Patents

Among his latest patents, two notable inventions stand out: the Low Cost Package Warpage Solution and the Photonic Integrated Circuit Packaging Architecture. The Low Cost Package Warpage Solution addresses challenges in device packaging by introducing a method that includes forming a reinforcement layer over a substrate. This inventive method allows for the placement of a device die into openings formed in the reinforcement layer, ensuring effective bonding with the substrate using solder bumps.

The Photonic Integrated Circuit Packaging Architecture, on the other hand, focuses on enhancing photonic packages and device assemblies. This invention integrates photonic integrated circuits (PICs) with optical lenses on the lateral sides, creating a sophisticated packaging solution that improves the efficiency and functionality of the devices.

Career Highlights

Omkar has amassed valuable experience working with renowned companies, including Intel Corporation and Tahoe Research, Ltd. His tenure in these organizations has enabled him to refine his skills and make impactful contributions to technology and innovation.

Collaborations

During his career, Omkar has collaborated with esteemed colleagues such as Nitin A Deshpande and Debendra Mallik. These partnerships have further fueled his creativity and allowed for the exchange of ideas that drive innovation forward.

Conclusion

Omkar G Karhade continues to pave the way for future technological advancements with his impressive array of patents and collaborative efforts. His work exemplifies the essence of innovation, contributing significantly to the fields of device packaging and photonic technology.