The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Dec. 23, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tolga Acikalin, San Jose, CA (US);

Tae Young Yang, Portland, OR (US);

Debabani Choudhury, Thousand Oaks, CA (US);

Shuhei Yamada, Vancouver, WA (US);

Roya Doostnejad, Los Altos, CA (US);

Hosein Nikopour, San Jose, CA (US);

Issy Kipnis, Berkeley, CA (US);

Oner Orhan, San Jose, CA (US);

Mehnaz Rahman, San Jose, CA (US);

Kenneth P. Foust, Beaverton, OR (US);

Christopher D. Hull, Portland, OR (US);

Telesphor Kamgaing, Chandler, AZ (US);

Omkar Karhade, Chandler, AZ (US);

Stefano Pellerano, Beaverton, OR (US);

Peter Sagazio, Portland, OR (US);

Sai Vadlamani, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H01Q 1/22 (2006.01); H04B 5/72 (2024.01); H10W 44/20 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01); H04B 5/22 (2024.01); H04B 5/24 (2024.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H01Q 1/2283 (2013.01); H04B 5/72 (2024.01); H10W 44/20 (2026.01); H10W 70/685 (2026.01); H10W 72/072 (2026.01); H10W 90/00 (2026.01); H04B 5/22 (2024.01); H04B 5/24 (2024.01); H10W 44/209 (2026.01); H10W 44/234 (2026.01); H10W 44/248 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01);
Abstract

Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.


Find Patent Forward Citations

Loading…