The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jun. 22, 2022
Intel Corporation, Santa Clara, CA (US);
Sagar Suthram, Portland, OR (US);
Ravindranath Vithal Mahajan, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Omkar G. Karhade, Chandler, AZ (US);
Wilfred Gomes, Portland, OR (US);
Pushkar Sharad Ranade, San Jose, CA (US);
Abhishek A. Sharma, Hillsboro, OR (US);
Tahir Ghani, Portland, OR (US);
Anand S. Murthy, Portland, OR (US);
Nitin A. Deshpande, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of an integrated circuit (IC) die comprise: a first region having a first surface; a second region attached to the first region along a first planar interface that is orthogonal to the first surface; and a third region attached to the second region along a second planar interface that is parallel to the first planar interface, the third region having a second surface, the second surface being coplanar with the first surface. The first region and the third region comprise a plurality of layers of conductive traces in a dielectric material, the conductive traces being orthogonal to the first and second surfaces; and bond-pads on the first and second surfaces, the bond-pads comprising portions of the respective conductive traces exposed on the first and second surfaces.