Chandler, AZ, United States of America

Ravindranath Vithal Mahajan

This inventor holds 95 USPTO granted patents and 71 published patent applications and 7 EPO patents, primarily in Photonic Integrated Circuits (CPC class H01L24-16). Top assignee: Intel Corporation. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ravindranath Vithal Mahajan. Retrieved from https://idiyas.com/inventor/ravindranath-vithal-mahajan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 95 

% Patents Active = 89.5

 

Average Co-Inventor Count = 4.8

ph-index = 8

Forward Citations = 250(Granted Patents)

Forward Citations (Not Self Cited) = 199(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Tempe, AZ (US) (2000 - 2016)
  • Chandler, AZ (US) (2012 - 2024)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Embedded Photonic Integrated Circuits
Microelectronic Assemblies
Stacked Dies
Optical Interconnection
Package Architecture
Heat Dissipation
Heterogeneous Integration
Interconnect Architecture
Thermal Performance
Co-Packaged Optics
Silicon Interposer
Through-Silicon Via
95 patents (USPTO):Explore Patents

Title: Ravindranath Vithal Mahajan: A Pioneer in Semiconductor Technology

Introduction:

Ravindranath Vithal Mahajan is a renowned inventor and engineer, based in Chandler, AZ, United States. With an impressive portfolio of 58 patents to his name, Mahajan has made significant contributions to the field of semiconductor packaging. Currently employed at Intel Corporation, Mahajan continues to push the boundaries of innovation in this ever-evolving industry.

Latest Patents:

Among Mahajan's recent patents is the "Full Package Vapor Chamber with IHS." This invention encompasses semiconductor packages designed to optimize heat dissipation. By incorporating an integrated heat spreader (IHS) with a lid and sidewalls, the package creates a vapor chamber that efficiently transfers heat away from the dies and package substrate. The patent also introduces a wick layer within the vapor chamber, comprising porous materials such as metals, powders, or graphite, further enhancing its cooling capabilities.

Another notable patent is the "Dual-sided Co-packaged Optics for High Bandwidth Networking Applications." This invention addresses the need for efficient optical to electrical switching in electronic packages. By attaching a first and second package substrate together, along with a die and multiple photonics engines, Mahajan's design facilitates high-speed data transfer within networking systems.

Career Highlights:

Mahajan has enjoyed a successful career at Intel Corporation, working on cutting-edge semiconductor technologies. His expertise lies in the field of advanced packaging and thermal management solutions. Mahajan's inventions have played a crucial role in improving performance, reliability, and energy efficiency in semiconductor devices, enabling the development of faster and more powerful electronics.

Collaborations:

Throughout his career, Mahajan has collaborated with esteemed colleagues to bring forth groundbreaking innovations. Notably, he has worked alongside Debendra Mallik and Robert L. Sankman, both highly respected experts in the semiconductor industry. Their collaborative efforts have resulted in pioneering advancements in semiconductor packaging and heat dissipation technologies.

Conclusion:

Ravindranath Vithal Mahajan is a trailblazer in the field of semiconductor packaging, known for his extensive patent portfolio and invaluable contributions to the industry. His work at Intel Corporation has revolutionized thermal management and advanced packaging techniques, leading to significant advancements in the efficiency and performance of modern electronics. Mahajan's dedication to innovation firmly establishes his position as a key figure in the ongoing evolution of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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