The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Nov. 19, 2020
Intel Corporation, Santa Clara, CA (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Brandon C. Marin, Gilbert, AZ (US);
Sameer Paital, Chandler, AZ (US);
Sai Vadlamani, Gilbert, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Xiaoqian Li, Chandler, AZ (US);
Suresh V. Pothukuchi, Chandler, AZ (US);
Sujit Sharan, Chandler, AZ (US);
Arnab Sarkar, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Nitin Deshpande, Chandler, AZ (US);
Divya Pratap, Hillsboro, OR (US);
Jeremy Ecton, Gilbert, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Kemal Aygün, Tempe, AZ (US);
Bai Nie, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
James E. Jaussi, Hillsboro, OR (US);
Jason M. Gamba, Gilbert, AZ (US);
Bryan K. Casper, Ridgefield, WA (US);
Gang Duan, Chandler, AZ (US);
Rajesh Inti, Hillsboro, OR (US);
Mozhgan Mansuri, Portland, OR (US);
Susheel Jadhav, Chandler, AZ (US);
Kenneth Brown, Tempe, AZ (US);
Ankur Agrawal, Chandler, AZ (US);
Priyanka Dobriyal, Milpitas, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.