This inventor holds 96 USPTO granted patents and 72 published patent applications and 9 EPO patents, primarily in Microelectronic Packaging (CPC class H01L23-5386). Top assignee: Intel Corporation. Active years: 2003-2026.
Inventors with similar research interests:
Location History:
- Phoenix, AR (US) (2007)
- Phoenix, AZ (US) (2003 - 2010)
- Chandler, AZ (US) (2009 - 2024)
Company Filing History:
Years Active: 2003-2026
Areas of Expertise:
Title: Innovator Spotlight: Rahul N. Manepalli
Introduction
Rahul N. Manepalli is a distinguished inventor based in Chandler, Arizona, known for his significant contributions to the field of electronic packaging. With an impressive portfolio of 83 patents, he has made notable advancements that enhance the efficiency and performance of electronic devices.
Latest Patents
Among his latest innovations is a patent for a "Nested Interposer with Through-Silicon Via Bridge Die." This electronic package features an interposer with a substrate and a cavity that partially penetrates the substrate. It incorporates a through interposer via (TIV) that connects to an interposer pad, enabling seamless communication with a nested component housed within the cavity. Additionally, the design integrates a core via below the nested component, further optimizing its functionality.
Another noteworthy patent is related to a "Dielectric-to-Metal Adhesion Promotion Material." This innovation focuses on creating an electronic substrate that improves adhesion between metal traces and dielectric layers. The adhesion promotion material comprises an organic component combined with a metal constituent designed to enhance the bonding strength, ultimately leading to improved device reliability.
Career Highlights
Rahul N. Manepalli currently works at Intel Corporation, a leading multinational corporation in technology solutions. His work involves developing advanced electronic packaging techniques that are critical to the evolving landscape of semiconductors. Rahul's expertise and innovative thinking have contributed to the advancement of Intel's product offerings.
Collaborations
Working alongside talented colleagues such as Srinivas V. Pietambaram and Gang Duan, Rahul has fostered a collaborative environment that thrives on shared knowledge and innovation. Together, they have pushed the boundaries of what is possible in electronic packaging, enhancing both performance and manufacturability.
Conclusion
In conclusion, Rahul N. Manepalli stands out as an influential inventor in the field of electronic technologies. His numerous patents reflect his dedication to innovation and his significant role at Intel Corporation. Through his collaborations and career milestones, Rahul continues to shape the future of electronics, making lasting impacts on the industry.