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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Robert Alan May

USPTO Granted Patents = 86 

 

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 148(Granted Patents)

Forward Citations (Not Self Cited) = 125(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Salt Lake City, UT (US) (1998)
  • Daly City, CA (US) (2000)
  • Chandler, AZ (US) (2017 - 2024)

Company Filing History:

goldMedal83 out of 54,688 
 
Intel Corporation
 patents
silverMedal1 out of 82 
 
Tahoe Research, Ltd.
 patents
bronzeMedal1 out of 832,718 
Other
 patents
where one patent can have more than one assignee

Years Active: 1998-2025

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Areas of Expertise:
Faraday Rotator Interconnect
EMIB Patch
High Density Interconnects
Microelectronic Packaging
Lithographic Cavity Formation
Embedded Multi-Die Interconnect
Die Interconnect Substrate
Magneto-Optical Kerr Effect
Panel Level Packaging
Via Structures
Electromigration Resistant Arrays
Photoimageable Dielectric
86 patents (USPTO):Explore Patents
1. 12481108 - Faraday rotator interconnect as a through-via configuration in a patch architecture (2025-11-25),
2. 12456705 - First layer interconnect first on carrier approach for EMIB patch (2025-10-28),
3. 12354992 - First layer interconnect first on carrier approach for EMIB patch (2025-07-08),
4. 12354963 - Lithographic cavity formation to enable EMIB bump pitch scaling (2025-07-08),
5. 12334443 - Lithographic cavity formation to enable EMIB bump pitch scaling (2025-06-17),
6. 12300613 - Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate (2025-05-13),
7. 12253722 - Magneto-optical Kerr effect interconnects for photonic packaging (2025-03-18),
8. 12218071 - Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers (2025-02-04),
9. 12218069 - Multi-chip package with high density interconnects (2025-02-04),
10. 12176292 - Microelectronic component having molded regions with through-mold vias (2024-12-24),
11. 12176223 - Integrated circuit package supports (2024-12-24),
12. 12148703 - EMIB patch on glass laminate substrate (2024-11-19),
13. 12046560 - Microelectronic device with embedded die substrate on interposer (2024-07-23),
14. 12040276 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-07-16),
15. 12014989 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-06-18),

Title: The Innovative Journey of Robert Alan May

Introduction: Robert Alan May, a talented inventor based in Chandler, Arizona, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Robert Alan May holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a cutting-edge AI algorithm for predictive maintenance in industrial machinery.

Career Highlights: Throughout his illustrious career, Robert Alan May has been recognized for his innovative spirit and problem-solving skills. He has received multiple awards for his groundbreaking inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations: Robert Alan May has collaborated with leading tech companies and research institutions to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that have revolutionized their respective industries.

Conclusion: In conclusion, Robert Alan May stands as a beacon of innovation in the technological landscape, continually striving to create solutions that make a positive impact on society. His relentless pursuit of excellence and creativity make him a true pioneer in the world of inventions.

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