The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Sep. 21, 2021
Intel Corporation, Santa Clara, CA (US);
Liang He, Chandler, AZ (US);
Jisu Jiang, Mountain View, CA (US);
Jung Kyu Han, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Yosuke Kanaoka, Chandler, AZ (US);
Jason M. Gamba, Gilbert, AZ (US);
Bai Nie, Chandler, AZ (US);
Robert Alan May, Chandler, AZ (US);
Kimberly A. Devine, Gilbert, AZ (US);
Mitchell Armstrong, Eden Prairie, NM (US);
Yue Deng, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques for a dam structure on a substrate that is proximate to a die coupled with the substrate, where the dam decreases the risk of die shift during encapsulation material flow over the die during the manufacturing process. The dam structure may fully encircle the die. During encapsulation material flow, the dam structure creates a cavity that moderates the different flow rates of material that otherwise would exert different pressures the sides of the die and cause to die to shift its position on the substrate. Other embodiments may be described and/or claimed.