This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: The Innovative Contributions of Yue Deng
Introduction
Yue Deng is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor technology. With a focus on enhancing interconnect systems, her work has implications for various applications in electronics.
Latest Patents
Yue Deng holds a patent for an "Omni directional interconnect with magnetic fillers in mold matrix." This patent encompasses various embodiments that relate to methods of creating omni-directional semiconductor interconnect bridges. The invention includes semiconductor assemblies featuring a mold layer composed of mold material, a first filler material dispersed within the mold material, and a second filler material that is heterogeneously dispersed.
Career Highlights
Yue Deng is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. Her role at Intel allows her to work on cutting-edge technologies that drive advancements in the electronics industry.
Collaborations
Yue has collaborated with talented coworkers, including Bohan Shan and Dingying David Xu, who contribute to her innovative projects and research endeavors.
Conclusion
Yue Deng's work exemplifies the spirit of innovation in the semiconductor field, showcasing her dedication to advancing technology through her patents and collaborations. Her contributions are paving the way for future developments in electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
