Chandler, AZ, United States of America

Yue Deng

This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yue Deng. Retrieved from https://idiyas.com/inventor/yue-deng-81b3q640

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 5.8

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Yue Deng

Introduction

Yue Deng is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor technology. With a focus on enhancing interconnect systems, her work has implications for various applications in electronics.

Latest Patents

Yue Deng holds a patent for an "Omni directional interconnect with magnetic fillers in mold matrix." This patent encompasses various embodiments that relate to methods of creating omni-directional semiconductor interconnect bridges. The invention includes semiconductor assemblies featuring a mold layer composed of mold material, a first filler material dispersed within the mold material, and a second filler material that is heterogeneously dispersed.

Career Highlights

Yue Deng is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. Her role at Intel allows her to work on cutting-edge technologies that drive advancements in the electronics industry.

Collaborations

Yue has collaborated with talented coworkers, including Bohan Shan and Dingying David Xu, who contribute to her innovative projects and research endeavors.

Conclusion

Yue Deng's work exemplifies the spirit of innovation in the semiconductor field, showcasing her dedication to advancing technology through her patents and collaborations. Her contributions are paving the way for future developments in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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