The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Sep. 24, 2021
Intel Corporation, Santa Clara, CA (US);
Bohan Shan, Chandler, AZ (US);
Dingying Xu, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);
Hongxia Feng, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Jung Kyu Han, Chandler, AZ (US);
Xiaoying Guo, Chandler, AZ (US);
Jeremy D. Ecton, Gilbert, AZ (US);
Santosh Tripathi, Portland, OR (US);
Bai Nie, Chandler, AZ (US);
Haobo Chen, Chandler, AZ (US);
Kyle Jordan Arrington, Gilbert, AZ (US);
Yue Deng, Chandler, AZ (US);
Wei Wei, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.