IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Xiaoying Guo

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2021 - 2022)
  • Chandler, AZ (US) (2023 - 2024)

Company Filing History:

goldMedal16 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2021-2025

where 'Filed Patents' based on already Granted Patents

16 patents (USPTO):
1. 12456705 - First layer interconnect first on carrier approach for EMIB patch (2025-10-28),
2. 12354992 - First layer interconnect first on carrier approach for EMIB patch (2025-07-08),
3. 12354883 - Omni directional interconnect with magnetic fillers in mold matrix (2025-07-08),
4. 12341117 - Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates (2025-06-24),
5. 12334422 - Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates (2025-06-17),
6. 12308329 - Chiplet first architecture for die tiling applications (2025-05-20),
7. 12255130 - Airgap structures for high speed signal integrity (2025-03-18),
8. 12142567 - Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density (2024-11-12),
9. 11990427 - Chiplet first architecture for die tiling applications (2024-05-21),
10. 11973041 - Chiplet first architecture for die tiling applications (2024-04-30),
11. 11955448 - Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches (2024-04-09),
12. 11948898 - Etch barrier for microelectronic packaging conductive structures (2024-04-02),
13. 11942334 - Microelectronic assemblies having conductive structures with different thicknesses (2024-03-26),
14. 11769735 - Chiplet first architecture for die tiling applications (2023-09-26),
15. 11404389 - In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages (2022-08-02),

Title: Innovator Spotlight: Xiaoying Guo

Introduction

Xiaoying Guo, an accomplished inventor based in Phoenix, AZ, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 15 patents, Guo continues to push the boundaries of innovation, particularly in integrated circuit packaging and interconnect solutions.

Latest Patents

Among her latest patents is the "First layer interconnect first on carrier approach for EMIB patch," which details a sophisticated patch structure for an integrated circuit package. This invention involves a core with a downward-facing first side and an upward-facing second side, featuring a solder resist layer that incorporates a first layer interconnect to facilitate connections with logic die. Additionally, the patent titled "Omni directional interconnect with magnetic fillers in mold matrix" showcases her work on semiconductor assemblies. This innovation includes a mold layer infused with both first and second filler materials, aimed at creating omni-directional interconnect bridges.

Career Highlights

Xiaoying Guo is currently a pivotal part of Intel Corporation, where she leverages her expertise to enhance semiconductor technologies. Her inventive spirit and technical prowess have positioned her as a leader in her field, allowing her to influence new approaches to semiconductor design and integration.

Collaborations

Throughout her career, Guo has collaborated with notable colleagues, including Gang Duan and Srinivas V Pietambaram. These partnerships highlight her ability to work within a team of talented professionals, fostering a collaborative environment that drives innovation forward.

Conclusion

With her extensive patent portfolio and a commitment to advancing semiconductor technology, Xiaoying Guo exemplifies the spirit of innovation. Her latest projects and collaborations at Intel Corporation continue to pave the way for future advancements in integrated circuit packaging and interconnect architectures. As technology evolves, Guo’s contributions will undoubtedly play a crucial role in shaping the future of semiconductor solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…