The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Sep. 24, 2021
Intel Corporation, Santa Clara, CA (US);
Kyle McElhinny, Tempe, AZ (US);
Onur Ozkan, Scottsdale, AZ (US);
Ali Lehaf, Chandler, AZ (US);
Xiaoying Guo, Chandler, AZ (US);
Steve Cho, Chandler, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Jung Kyu Han, Chandler, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Sashi Kandanur, Chandler, AZ (US);
Alexander Aguinaga, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes an array of bumps to electrically couple the die to the substrate. Each of the bumps have a corresponding base. Different ones of the bases have different widths that vary spatially across the array of bumps.