Chandler, AZ, United States of America

Bohan Shan

This inventor holds 8 USPTO granted patents and 118 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bohan Shan. Retrieved from https://idiyas.com/inventor/bohan-shan-59lwphi9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.1

ph-index = 1


Company Filing History:


Years Active: 2024-2026

Loading Chart...
Loading Chart...
8 patents (USPTO):Explore Patents

Title: Bohan Shan: Innovator in Conductive Features for Integrated Circuits

Introduction

Bohan Shan, an accomplished inventor located in Chandler, AZ, has made significant strides in the field of integrated circuit (IC) packaging. Known for his innovative approach, he holds a patent that is pivotal for enhancing the performance of conductive features in IC package substrates.

Latest Patents

Bohan Shan's notable patent is titled "Selectively roughened copper architectures for low insertion loss conductive features." This patent describes an integrated circuit package substrate comprising a metallization level incorporated within a dielectric material. The innovation centers around a metallization level that includes a multitude of conductive features, where each feature possesses distinct surface characteristics. Specifically, the top surface of one conductive feature exhibits a higher average surface roughness compared to the sidewall surface of another feature. This design aims to reduce insertion loss in electronic applications, enhancing overall efficiency.

Career Highlights

Bohan Shan contributes his expertise to Intel Corporation, a global leader in computing innovation. Throughout his career, he has focused on improving the design and functionality of IC package substrates, which are essential for modern electronics. His commitment to research and innovation has bolstered the capabilities of integrated circuits.

Collaborations

In his journey at Intel Corporation, Bohan has collaborated with esteemed colleagues such as Jieying Kong and Yiyang Zhou. Together, they work towards advancing technologies that improve electronic performance, validating the importance of teamwork in the innovation process.

Conclusion

Bohan Shan's contributions to the field of integrated circuits underscore the impact of innovative thinking in technology. His patent on selectively roughened copper architectures stands as a testament to his expertise and dedication to enhancing electronic components. As technology continues to evolve, inventors like Bohan play a crucial role in shaping the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…