The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Dec. 21, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kyle Arrington, Gilbert, AZ (US);

Bohan Shan, Chandler, AZ (US);

Haobo Chen, Chandler, AZ (US);

Ziyin Lin, Chandler, AZ (US);

Hongxia Feng, Chandler, AZ (US);

Yiqun Bai, Chandler, AZ (US);

Dingying Xu, Chandler, AZ (US);

Xiaoying Guo, Chandler, AZ (US);

Bai Nie, Chandler, AZ (US);

Srinivas Pietambaram, Chandler, AZ (US);

Gang Duan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/47 (2026.01); H10W 40/43 (2026.01); H10W 70/60 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01);
U.S. Cl.
CPC ...
H10W 40/47 (2026.01); H10W 40/43 (2026.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01);
Abstract

Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates are disclosed. An example glass core of an integrated circuit (IC) package disclosed herein includes a fluid inlet to receive a cooling fluid, a fluid outlet, and a channel to fluidly couple the fluid inlet to the fluid outlet, the cooling fluid to flow through the channel from the fluid inlet to the fluid outlet, the channel fluidly isolated from one or more vias extending between a first surface and a second surface of the glass core.


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Arrington, Kyle. (2026). Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates (U.S. Patent No. 12787778). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787778

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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