Dingying David Xu

This inventor holds 33 USPTO granted patents and 91 published patent applications and 2 EPO patents, primarily in Microelectronic Packaging. Top assignees: Intel Corporation, Esc Inc., Other. Active years: 2002-2026.

USPTO Granted Patents = 33 (Patent Applications = 91)

% Patents Active = 57.6

EPO Patents = 2 (Patent Applications = 15)

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 71(Granted Patents)

Location History:

Bethlehem, PA (US) (2002)
Maricopa, AZ (US) (2009 - 2017)
Chandler, AZ (US) (2009 - 2024)

Company Filing History:

1 out of 834,411

Other

patents

Years Active: 2002-2026

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Areas of Expertise:

Glass Substrate Device

Hybrid Bonding

Microelectronic Assemblies

Die Attach Materials

Interconnects

Thermal Management

Flexible Underfill

Conductive Filling Material

Solder-Filled Vias

Probe Pins

Electrical Testing

Coreless Packages

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12696776 - Glass substrate device with embedded components (2026-07-28),

2. 12642130 - Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the die (2026-05-26),

3. 12581988 - Microelectronic assemblies with through die attach film connections (2026-03-17),

4. 12568831 - Patternable die attach materials and processes for patterning (2026-03-03),

5. 12494441 - BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load (2025-12-09),

6. 12354883 - Omni directional interconnect with magnetic fillers in mold matrix (2025-07-08),

7. 12341117 - Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates (2025-06-24),

8. 12230564 - Package substrate z-disaggregation with liquid metal interconnects (2025-02-18),

9. 12230563 - Method to enable 30 microns pitch EMIB or below (2025-02-18),

10. 12068222 - Dummy die structures of a packaged integrated circuit device (2024-08-20),

11. 12033930 - Selectively roughened copper architectures for low insertion loss conductive features (2024-07-09),

12. 11923312 - Patternable die attach materials and processes for patterning (2024-03-05),

13. 11676891 - Method to enable 30 microns pitch EMIB or below (2023-06-13),

14. 11340258 - Probe pins with etched tips for electrical die test (2022-05-24),

15. 11088062 - Method to enable 30 microns pitch EMIB or below (2021-08-10),

Title: The Innovative Journey of Dingying David Xu

Introduction: Dingying David Xu, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Dingying David Xu holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a background in engineering and a passion for problem-solving, Dingying David Xu has successfully developed cutting-edge solutions that have revolutionized various industries. His commitment to innovation and excellence is evident in the numerous patents he has secured throughout his career.

Collaborations: Throughout his career, Dingying David Xu has collaborated with leading research institutions, universities, and technology companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of his innovative ideas.

Conclusion: Dingying David Xu's relentless pursuit of innovation and his dedication to pushing the boundaries of technology have established him as a respected figure in the world of inventors. His impressive portfolio of patents and his ongoing commitment to creating impactful solutions continue to inspire the next generation of innovators.