The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Mar. 30, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Hongxia Feng, Chandler, AZ (US);
Xiaoxuan Sun, Phoenix, AZ (US);
Amey Anant Apte, Chandler, AZ (US);
Dingying David Xu, Chandler, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Ashay Dani, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 72/01951 (2026.01); H10W 72/0198 (2026.01); H10W 72/07338 (2026.01); H10W 72/244 (2026.01); H10W 72/942 (2026.01); H10W 72/944 (2026.01); H10W 72/951 (2026.01); H10W 72/952 (2026.01); H10W 72/953 (2026.01); H10W 80/333 (2026.01); H10W 90/701 (2026.01); H10W 90/794 (2026.01);
Abstract
Embodiments herein relate to systems, apparatuses, techniques or processes for hybrid bonding a die to a substrate. In embodiments, the die may be a chiplet that is bonded to an interconnect. In embodiments, the die may be a plurality of dies, where the plurality of dies are hybrid bonded to a substrate, to each other, or a combination of both. Other embodiments may be described and/or claimed.