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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Sairam Agraharam

This inventor holds 50 USPTO granted patents and 25 published patent applications, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sairam Agraharam. Retrieved from https://idiyas.com/inventor/sairam-agraharam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 50 

% Patents Active = 76.0

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 165(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2004 - 2017)
  • Chandler, AZ (US) (2015 - 2024)

Company Filing History:

goldMedal50 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2004-2026

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Areas of Expertise:
Microelectronic Assemblies
Multi-Chip Packaging
Thermal Solutions
Warpage Control
Silicon Bridges
3D Packaging
Integrated Circuit
Die Singulation
Interconnect Structures
Moisture Seal Coating
Flexible Computing Fabric
Wearable Imaging Sensor
50 patents (USPTO):Explore Patents
1. 12642130 - Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the die (2026-05-26),
2. 12581988 - Microelectronic assemblies with through die attach film connections (2026-03-17),
3. 12564090 - Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structure (2026-02-24),
4. 12476235 - Multi-chip packaging (2025-11-18),
5. 12469801 - Moisture seal coating of hybrid bonded stacked die package assembly (2025-11-11),
6. 12334472 - Multiple wafer stack architecture to enable singulation (2025-06-17),
7. 12243792 - Microelectronic structures including bridges (2025-03-04),
8. 12199085 - Multi-chip packaging (2025-01-14),
9. 12176268 - Open cavity bridge co-planar placement architectures and processes (2024-12-24),
10. 12170253 - Metal-free frame design for silicon bridges for semiconductor packages (2024-12-17),
11. 12119317 - Singulation of microelectronic components with direct bonding interfaces (2024-10-15),
12. 12074121 - Metal-free frame design for silicon bridges for semiconductor packages (2024-08-27),
13. 12027448 - Open cavity bridge power delivery architectures and processes (2024-07-02),
14. 11887962 - Microelectronic structures including bridges (2024-01-30),
15. 11817444 - Multi-chip packaging (2023-11-14),

Title: The Innovative Journey of Sairam Agraharam

Introduction:

Sairam Agraharam, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology through his innovative creations and patents.

Latest Patents:

Sairam Agraharam holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his diverse range of expertise and creativity.

Career Highlights:

With a background in engineering and a passion for problem-solving, Sairam Agraharam has successfully developed groundbreaking solutions that have garnered attention in the industry. His career highlights include the development of a cutting-edge smart home system and a revolutionary solar-powered device.

Collaborations:

Throughout his career, Sairam Agraharam has collaborated with leading tech companies and research institutions to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in the successful implementation of his innovative ideas.

Conclusion:

In conclusion, Sairam Agraharam stands as a visionary inventor who continues to push the boundaries of technology with his creative solutions. His dedication to innovation and his commitment to making a positive impact on society make him a standout figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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