The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Dec. 17, 2021
Intel Corporation, Santa Clara, CA (US);
Debendra Mallik, Chandler, AZ (US);
Mohammad Enamul Kabir, Portland, OR (US);
Nitin Deshpande, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Arnab Sarkar, Chandler, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Christopher Pelto, Beaverton, OR (US);
Gwang-Soo Kim, Portland, OR (US);
Ravindranath Mahajan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Stacked die assemblies having a moisture sealant layer according to embodiments are described herein. A microelectronic package structure having a first die with a second and an adjacent third die on the first die. Each of the second and third die comprise hybrid bonding interfaces with the first die. A first layer is on a region of the first die adjacent sidewalls of the second and the third dies, and adjacent an edge portion of the first die. The first layer comprises a diffusion barrier material A second layer is over the first layer, the second layer, wherein a top surface of the second layer is substantially coplanar with the top surfaces of the second and third dies. The first layer provides a hermetic moisture sealant layer for stacked die package structures.