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For the Inventor, By the Inventor

Beaverton, OR, United States of America

Christopher M Pelto

This inventor holds 20 USPTO granted patents and 16 published patent applications and 1 EPO patent, primarily in Packaging Architecture. Top assignee: Intel Corporation. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christopher M Pelto. Retrieved from https://idiyas.com/inventor/christopher-m-pelto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 90.0

 

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • Aloha, OR (US) (2015)
  • Beaverton, OR (US) (2015 - 2022)

Company Filing History:

goldMedal20 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2015-2026

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Areas of Expertise:
Through-Dielectric Vias
Redistribution Layers
Thin Film Transistor
Quasi-Monolithic Chip
Moisture Seal Coating
Die Stacking
Wafer Bow Reduction
3D Interconnect Structure
Thermal Management
MEMS
Power Distribution Layer
20 patents (USPTO):Explore Patents
1. 12733517 - Packaging architecture with patterned through-dielectric vias and redistribution layers (2026-09-08),
2. 12667001 - Integrated packaging architecture with solder and non-solder interconnects (2026-06-23),
3. 12588241 - Asymmetric source and drain contacts for a thin film transistor (TFT) structure (2026-03-24),
4. 12581938 - Package architecture for quasi-monolithic chip with backside power (2026-03-17),
5. 12500207 - Packaging architecture with intermediate routing layers (2025-12-16),
6. 12469801 - Moisture seal coating of hybrid bonded stacked die package assembly (2025-11-11),
7. 12438102 - Hermetic barrier surrounding a plurality of dies (2025-10-07),
8. 12436467 - Simulating die rotation to minimize area overhead of reticle stitching for stacked dies (2025-10-07),
9. 12432897 - Cooling approaches for stitched dies (2025-09-30),
10. 12431441 - Interlayer dielectric stack optimization for wafer bow reduction (2025-09-30),
11. 12107040 - Metal insulator metal (MIM) capacitor (2024-10-01),
12. 11222863 - Techniques for die stacking and associated configurations (2022-01-11),
13. 10229879 - Thickened stress relief and power distribution layer (2019-03-12),
14. 9850121 - Backside bulk silicon MEMS (2017-12-26),
15. 9530740 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach (2016-12-27),

Title: Christopher M Pelto: A Pioneer in Capacitor Innovation

Introduction

Christopher M Pelto, an outstanding inventor based in Beaverton, OR, has made significant contributions to the field of electronics through his innovative patents. With a total of ten patents to his name, Pelto has emerged as a key figure in the development of advanced capacitor technologies, showcasing a remarkable blend of technical expertise and creativity.

Latest Patents

Among his latest inventions is the Metal Insulator Metal (MIM) capacitor. This innovative design includes a series of electrode plates and capacitor dielectrics that enhance performance and efficiency. The MIM capacitor features a first electrode plate with a capacitor dielectric, followed by a second electrode plate, maintaining a parallel arrangement with the first. Additional layers, including third and fourth electrode plates and their corresponding dielectrics, contribute to its sophisticated architecture. Another notable patent focuses on techniques for die stacking and associated configurations for integrated circuit (IC) devices. This method outlines a procedure for sorting, dicing, and bonding first known good dies with second known good dies, aimed at creating efficient stacked ICs, which are critical for modern electronic applications.

Career Highlights

Christopher M Pelto is a key inventor at Intel Corporation, where he has been instrumental in enhancing the technological capabilities of capacitor designs. His work has not only fostered innovation within the company but has also contributed to broader advancements in the semiconductor industry.

Collaborations

Throughout his career, Pelto has collaborated with notable coworkers, including Andrew W Yeoh and Kevin J Lee. Their collective efforts have facilitated the successful development and implementation of several innovative technologies, reflecting a strong team dynamic that propels their projects toward success.

Conclusion

Christopher M Pelto's contributions to the field of electronics, specifically through his patents on capacitors and IC devices, mark him as a remarkable inventor. His work at Intel Corporation, combined with fruitful collaborations, continues to drive forward the boundaries of technology, ensuring that advancements in capacitors remain at the forefront of electronic innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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