IDiyas

For the Inventor, By the Inventor

Beaverton, OR, United States of America

Christopher M Pelto

USPTO Granted Patents = 15 

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 63(Granted Patents)


Location History:

  • Aloha, OR (US) (2015)
  • Beaverton, OR (US) (2015 - 2022)

Company Filing History:

goldMedal15 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2015-2025

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15 patents (USPTO):
1. 12469801 - Moisture seal coating of hybrid bonded stacked die package assembly (2025-11-11),
2. 12438102 - Hermetic barrier surrounding a plurality of dies (2025-10-07),
3. 12436467 - Simulating die rotation to minimize area overhead of reticle stitching for stacked dies (2025-10-07),
4. 12432897 - Cooling approaches for stitched dies (2025-09-30),
5. 12431441 - Interlayer dielectric stack optimization for wafer bow reduction (2025-09-30),
6. 12107040 - Metal insulator metal (MIM) capacitor (2024-10-01),
7. 11222863 - Techniques for die stacking and associated configurations (2022-01-11),
8. 10229879 - Thickened stress relief and power distribution layer (2019-03-12),
9. 9850121 - Backside bulk silicon MEMS (2017-12-26),
10. 9530740 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach (2016-12-27),
11. 9496173 - Thickened stress relief and power distribution layer (2016-11-15),
12. 9449913 - 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias (2016-09-20),
13. 9196752 - Backside bulk silicon MEMS (2015-11-24),
14. 9142510 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach (2015-09-22),
15. 8933564 - Landing structure for through-silicon via (2015-01-13),

Title: Christopher M Pelto: A Pioneer in Capacitor Innovation

Introduction

Christopher M Pelto, an outstanding inventor based in Beaverton, OR, has made significant contributions to the field of electronics through his innovative patents. With a total of ten patents to his name, Pelto has emerged as a key figure in the development of advanced capacitor technologies, showcasing a remarkable blend of technical expertise and creativity.

Latest Patents

Among his latest inventions is the Metal Insulator Metal (MIM) capacitor. This innovative design includes a series of electrode plates and capacitor dielectrics that enhance performance and efficiency. The MIM capacitor features a first electrode plate with a capacitor dielectric, followed by a second electrode plate, maintaining a parallel arrangement with the first. Additional layers, including third and fourth electrode plates and their corresponding dielectrics, contribute to its sophisticated architecture. Another notable patent focuses on techniques for die stacking and associated configurations for integrated circuit (IC) devices. This method outlines a procedure for sorting, dicing, and bonding first known good dies with second known good dies, aimed at creating efficient stacked ICs, which are critical for modern electronic applications.

Career Highlights

Christopher M Pelto is a key inventor at Intel Corporation, where he has been instrumental in enhancing the technological capabilities of capacitor designs. His work has not only fostered innovation within the company but has also contributed to broader advancements in the semiconductor industry.

Collaborations

Throughout his career, Pelto has collaborated with notable coworkers, including Andrew W Yeoh and Kevin J Lee. Their collective efforts have facilitated the successful development and implementation of several innovative technologies, reflecting a strong team dynamic that propels their projects toward success.

Conclusion

Christopher M Pelto's contributions to the field of electronics, specifically through his patents on capacitors and IC devices, mark him as a remarkable inventor. His work at Intel Corporation, combined with fruitful collaborations, continues to drive forward the boundaries of technology, ensuring that advancements in capacitors remain at the forefront of electronic innovation.

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