The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Dec. 10, 2021
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Tempe, AZ (US);
Christopher M. Pelto, Beaverton, OR (US);
Kimin Jun, Portland, OR (US);
Brandon M. Rawlings, Chandler, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Bradley A. Jackson, Lake Oswego, OR (US);
Robert J. Munoz, Round Rock, TX (US);
Johanna M. Swan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer; and a third plurality of IC dies in a third layer, in which: the second layer is between the first layer and the third layer, an interface between two adjacent layers comprises interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects, and each of the first layer, the second layer, and the third layer comprises a dielectric material, and further comprises conductive traces in the dielectric material.