Gwang-Soo Kim

Title: Gwang-Soo Kim: Innovator in Microelectronic Packaging

Introduction

Gwang-Soo Kim is a notable inventor based in Portland, OR (US), recognized for his contributions to microelectronic packaging technologies. With a total of 4 patents to his name, Kim has made significant advancements in the field, particularly in the areas of moisture seal coatings and interlayer dielectric stack optimization.

Latest Patents

One of Kim's latest patents is titled "Moisture seal coating of hybrid bonded stacked die package assembly." This invention describes stacked die assemblies that incorporate a moisture sealant layer, enhancing the reliability of microelectronic package structures. The design features a first die with adjacent second and third dies, each utilizing hybrid bonding interfaces. The first layer, made of a diffusion barrier material, provides a hermetic moisture sealant layer for these stacked die package structures.

Another significant patent is "Interlayer dielectric stack optimization for wafer bow reduction." This patent outlines an integrated circuit (IC) die that includes a first metallization layer and a second metallization layer, with an interlayer dielectric (ILD) stack positioned between them. The ILD stack features a stress modulation layer designed to mitigate intrinsic stress, thereby improving the overall performance of the integrated circuit.

Career Highlights

Gwang-Soo Kim is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies in microelectronics. His work has been instrumental in advancing the capabilities of integrated circuits and packaging solutions.

Collaborations

Throughout his career, Kim has collaborated with several talented individuals, including Doug B Ingerly and Aaron D Lilak. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Gwang-Soo Kim's contributions to microelectronic packaging through his innovative patents demonstrate his expertise and commitment to advancing technology in this field. His work at Intel Corporation continues to influence the future of microelectronics.