The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Dec. 27, 2023
Intel Corporation, Santa Clara, CA (US);
Robert L. Sankman, Phoenix, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Shengquan Ou, Chandler, AZ (US);
Thomas J De Bonis, Tempe, AZ (US);
Todd Spencer, Chandler, AZ (US);
Yang Sun, Chandler, AZ (US);
Guotao Wang, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.