This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Amey Anant Apte: Innovator in Hybrid Bonding Technology
Introduction
Amey Anant Apte is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly in hybrid bonding processes. His innovative work has led to advancements that enhance the performance and efficiency of electronic devices.
Latest Patents
Amey holds a patent for "Hybrid bonding a die to a substrate with vias connecting metal pads on both sides of the die." This patent describes systems, apparatuses, techniques, or processes for hybrid bonding a die to a substrate. In his invention, the die may be a chiplet that is bonded to an interconnect. Additionally, the die may consist of a plurality of dies that are hybrid bonded to a substrate, to each other, or a combination of both. This patent showcases Amey's expertise in developing cutting-edge solutions in the semiconductor industry. He has 1 patent to his name.
Career Highlights
Amey Anant Apte is currently employed at Intel Corporation, a leading technology company known for its innovations in computing and semiconductor manufacturing. His role at Intel allows him to work on groundbreaking projects that push the boundaries of technology.
Collaborations
Amey collaborates with talented individuals in his field, including Hongxia Feng and Xiaoxuan Sun. Their combined expertise contributes to the advancement of hybrid bonding technologies and enhances the overall innovation landscape at Intel.
Conclusion
Amey Anant Apte is a prominent inventor whose work in hybrid bonding technology is paving the way for future advancements in the semiconductor industry. His contributions are vital to the ongoing evolution of electronic devices, and his innovative spirit continues to inspire others in the field.