The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Sep. 25, 2020
Intel Corporation, Santa Clara, CA (US);
Mitul Modi, Phoenix, AZ (US);
Joseph Van Nausdle, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Nicholas Haehn, Scottsdale, AZ (US);
Vaibhav Agrawal, Chandler, AZ (US);
Digvijay Raorane, Chandler, AZ (US);
Dingying Xu, Chandler, AZ (US);
Ziyin Lin, Chandler, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.