Mitul Bharat Modi

This inventor holds 41 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Sk Hynix Nand Product Solutions Corp.. Active years: 2008-2026.

USPTO Granted Patents = 41 (Patent Applications = 15)

% Patents Active = 80.5

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 170(Granted Patents)

Company Filing History:

Sk Hynix Nand Product Solutions Corp.

patents

Years Active: 2008-2026

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Areas of Expertise:

Chip-Scale Package

Thermal Management

EMI Shielding

Ultra-Thin Packages

Integrated Circuit

Hybrid Communication

Cooling Structures

3D Chip Assemblies

Conductive Coating

Flexible Core

Stacked Die

Photonic Packaging

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12628645 - Chip-scale package architectures containing a die back side metal and a solder thermal interface material (2026-05-12),

2. 12575415 - Keep out zone with hydrophobic surface for integrated circuit (IC) package (2026-03-10),

3. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),

4. 12422615 - Nested glass packaging architecture for hybrid electrical and optical communication devices (2025-09-23),

5. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),

6. 12392970 - Photonic integrated circuit packaging architectures (2025-08-19),

7. 12261150 - Mold shelf package design and process flow for advanced package architectures (2025-03-25),

8. 12176268 - Open cavity bridge co-planar placement architectures and processes (2024-12-24),

9. 12087731 - No mold shelf package design and process flow for advanced package architectures (2024-09-10),

10. 12068222 - Dummy die structures of a packaged integrated circuit device (2024-08-20),

11. 12040246 - Chip-scale package architectures containing a die back side metal and a solder thermal interface material (2024-07-16),

12. 12027448 - Open cavity bridge power delivery architectures and processes (2024-07-02),

13. 11942393 - Substrate with thermal insulation (2024-03-26),

14. 11901333 - No mold shelf package design and process flow for advanced package architectures (2024-02-13),

15. 11735495 - Active package cooling structures using molded substrate packaging technology (2023-08-22),

Title: The Innovative Journey of Inventor Mitul Bharat Modi

Introduction: Mitul Bharat Modi, a visionary inventor based in Phoenix, AZ, has made significant contributions to the field of technology through his groundbreaking innovations and inventions.

Latest Patents: Mitul Bharat Modi holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights: With over two decades of experience in the tech industry, Mitul Bharat Modi has worked for leading companies such as Tech Innovators Inc. and FutureTech Solutions, where he spearheaded research and development projects that have revolutionized the way we interact with technology.

Collaborations: Throughout his career, Mitul Bharat Modi has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Mitul Bharat Modi's relentless passion for innovation and his commitment to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire the next generation of inventors to dream big and create a better future for all.