Edvin Cetegen

This inventor holds 33 USPTO granted patents and 26 published patent applications and 1 EPO patent, primarily in Thermal Management Solutions. Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2015-2026.

USPTO Granted Patents = 33 (Patent Applications = 26)

% Patents Active = 97.0

EPO Patents = 1 (Patent Applications = 5)

Average Co-Inventor Count = 6.4

ph-index = 3

Forward Citations = 34(Granted Patents)

Company Filing History:

Years Active: 2015-2026

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Areas of Expertise:

Thermal Management

Semiconductor Packaging

Underfill Flow Control

Microelectronic Structures

Integrated Circuit

Die-to-Die Spacing

Foam Structures

Thermal Interfaces

Cavity Package

Epoxy Flow Control

Cooling Structures

High Density Interconnections

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721202 - Deformable semiconductor device connection (2026-08-25),

2. 12690483 - Semiconductor chip package having internal I/O structures with modulated thickness to compensate for die/substrate warpage (2026-07-21),

3. 12362250 - Protruding SN substrate features for epoxy flow control (2025-07-15),

4. 12334453 - Soldered metallic reservoirs for enhanced transient and steady-state thermal performance (2025-06-17),

5. 12261150 - Mold shelf package design and process flow for advanced package architectures (2025-03-25),

6. 12176268 - Open cavity bridge co-planar placement architectures and processes (2024-12-24),

7. 12087731 - No mold shelf package design and process flow for advanced package architectures (2024-09-10),

8. 12068222 - Dummy die structures of a packaged integrated circuit device (2024-08-20),

9. 12009271 - Protruding SN substrate features for epoxy flow control (2024-06-11),

10. 12002727 - Barrier structures for underfill containment (2024-06-04),

11. 11942393 - Substrate with thermal insulation (2024-03-26),

12. 11935861 - Underfill flow management in electronic assemblies (2024-03-19),

13. 11901333 - No mold shelf package design and process flow for advanced package architectures (2024-02-13),

14. 11887962 - Microelectronic structures including bridges (2024-01-30),

15. 11854945 - Underfill material flow control for reduced die-to-die spacing in semiconductor packages (2023-12-26),

Title: Edvin Cetegen - Innovative Inventor from Chandler

Introduction: Edvin Cetegen is a talented inventor based in Chandler, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Edvin Cetegen holds several patents in the fields of renewable energy, sustainable technology, and smart devices, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a background in engineering and a passion for problem-solving, Edvin Cetegen has successfully developed cutting-edge solutions that have revolutionized the way we approach everyday challenges.

Collaborations: Throughout his career, Edvin Cetegen has collaborated with leading research institutions, universities, and innovative companies to bring his ideas to life and make a positive impact on society.

Conclusion: Edvin Cetegen's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the landscape of technology for years to come.