The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jun. 29, 2023
Intel Corporation, Santa Clara, CA (US);
Nicholas Neal, Scottsdale, AZ (US);
Nicholas S. Haehn, Mesa, AZ (US);
Sergio Chan Arguedas, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Jacob Vehonsky, Gilbert, AZ (US);
Steve S. Cho, Chandler, AZ (US);
Rahul Jain, Gilbert, AZ (US);
Antariksh Rao Pratap Singh, Gilbert, AZ (US);
Tarek A. Ibrahim, Mesa, AZ (US);
Thomas Heaton, Mesa, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.