Company Filing History:
Years Active: 2019-2025
Title: Innovations of Thomas Heaton
Introduction
Thomas Heaton is a notable inventor based in Mesa, AZ, with a remarkable portfolio of 10 patents. His work primarily focuses on electronic packaging and thermal management solutions, contributing significantly to advancements in the field.
Latest Patents
One of his latest patents is titled "Protruding SN substrate features for epoxy flow control." This invention includes electronic packages with underfill flow control features, where a die is coupled to a package substrate by interconnects, and a flow control feature is adjacent to the substrate. The flow control feature is designed to be electrically isolated from the circuitry of the electronic package, enhancing the reliability of the device. Another significant patent is "Soldered metallic reservoirs for enhanced transient and steady-state thermal performance." This patent describes electronic packages with thermal solutions, including an integrated heat spreader that is thermally coupled to a die, improving thermal management in electronic devices.
Career Highlights
Throughout his career, Thomas Heaton has worked with prominent companies such as Intel Corporation and Tahoe Research, Ltd. His contributions to these organizations have been instrumental in developing innovative electronic solutions.
Collaborations
He has collaborated with notable professionals in the field, including Steve S Cho and Srinivas V Pietambaram, further enhancing the impact of his inventions.
Conclusion
Thomas Heaton's innovative contributions to electronic packaging and thermal management have established him as a significant figure in the field of invention. His patents reflect a commitment to advancing technology and improving electronic device performance.