The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Apr. 10, 2024
Intel Corporation, Santa Clara, CA (US);
Edvin Cetegen, Chandler, AZ (US);
Jacob Vehonsky, Gilbert, AZ (US);
Nicholas S. Haehn, Scottsdale, AZ (US);
Thomas Heaton, Mesa, AZ (US);
Steve S. Cho, Chandler, AZ (US);
Rahul Jain, Gilbert, AZ (US);
Tarek Ibrahim, Mesa, AZ (US);
Antariksh Rao Pratap Singh, Gilbert, AZ (US);
Nicholas Neal, Scottsdale, AZ (US);
Sergio Chan Arguedas, Chandler, AZ (US);
Vipul Mehta, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.