Rahul Jain

This inventor holds 44 USPTO granted patents and 18 published patent applications, plus 1 CIPO patent and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Sk Hynix Nand Product Solutions Corp. (Dba Solidigm). Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rahul Jain. Retrieved from https://idiyas.com/inventor/rahul-jain-osoq47bs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 44 (Patent Applications = 18)

% Patents Active = 97.7

CIPO Patents = 1 (Patent Applications = 2)

EPO Patents = 1 (Patent Applications = 9)

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 32(Granted Patents)

Location History:

Gilbert, AZ (US) (2017 - 2024)
Chandler, AZ (US) (2019 - 2024)

Company Filing History:

Sk Hynix Nand Product Solutions Corp. (Dba Solidigm)

patents

Years Active: 2017-2025

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Areas of Expertise:

Magnetic Materials

Underfill Barriers

Thermal Performance

Die Interconnect Substrates

Coreless Packages

Thin Film Capacitors

Magnetic Inductor Structures

Electronic Device Packages

Encapsulated Features

Cavity Structures

Conductive Structures

Patterning Methods

44 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12362250 - Protruding SN substrate features for epoxy flow control (2025-07-15),

2. 12334453 - Soldered metallic reservoirs for enhanced transient and steady-state thermal performance (2025-06-17),

3. 12334447 - Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) (2025-06-17),

4. 12327773 - Package with underfill containment barrier (2025-06-10),

5. 12224264 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2025-02-11),

6. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),

7. 12009271 - Protruding SN substrate features for epoxy flow control (2024-06-11),

8. 11935805 - Package with underfill containment barrier (2024-03-19),

9. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),

10. 11881463 - Coreless organic packages with embedded die and magnetic inductor structures (2024-01-23),

11. 11862552 - Methods of embedding magnetic structures in substrates (2024-01-02),

12. 11842981 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2023-12-12),

13. 11776864 - Corner guard for improved electroplated first level interconnect bump height range (2023-10-03),

14. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),

15. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),

Title: Innovator Spotlight: Rahul Jain from Gilbert, AZ

Introduction:

Rahul Jain from Gilbert, AZ, is a remarkable inventor with a passion for technological advancements. With 37 patents to his name, Rahul is a driving force in the field of innovation.

Latest Patents:

Rahul's recent patents highlight his ingenuity and expertise in the industry. One of his innovations is the "Package with underfill containment barrier," featuring a substrate with a raised barrier containing electroplated metal. Another groundbreaking invention is the "Substrate assembly with encapsulated magnetic feature," revolutionizing inductor technology.

Career Highlights:

Rahul Jain is a valued member of Intel Corporation, where his innovative spirit thrives. His contributions have significantly impacted the company's technological advancements and product development strategies.

Collaborations:

In his professional journey, Rahul has collaborated with esteemed coworkers such as Sai Vadlamani and Kyu Oh Lee. Together, they have worked on cutting-edge projects, pushing the boundaries of technological innovation.

Conclusion:

Rahul Jain's dedication to driving technological progress through his patented inventions is truly inspiring. His expertise, coupled with his collaborative spirit, continues to shape the landscape of innovation. Gilbert, AZ, is indeed fortunate to have such a visionary inventor in its midst.

Profile summary based on public USPTO records.