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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Rahul Jain

USPTO Granted Patents = 44 

 

 

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Gilbert, AZ (US) (2017 - 2024)
  • Chandler, AZ (US) (2019 - 2024)

Company Filing History:

goldMedal43 out of 54,750 
 
Intel Corporation
 patents
where one patent can have more than one assignee

Years Active: 2017-2025

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Areas of Expertise:
Epoxy Flow Control
Vertical Interconnect Access
Thermal Performance
Underfill Containment Barrier
Magnetic Materials
Coreless Organic Packages
Thin Film Capacitors
Magnetic Inductor Structures
Microelectronic Assemblies
Cavity Structures
Power Delivery
Semiconductor Packaging
44 patents (USPTO):Explore Patents
1. 12362250 - Protruding SN substrate features for epoxy flow control (2025-07-15),
2. 12334453 - Soldered metallic reservoirs for enhanced transient and steady-state thermal performance (2025-06-17),
3. 12334447 - Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) (2025-06-17),
4. 12327773 - Package with underfill containment barrier (2025-06-10),
5. 12224264 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2025-02-11),
6. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),
7. 12009271 - Protruding SN substrate features for epoxy flow control (2024-06-11),
8. 11935805 - Package with underfill containment barrier (2024-03-19),
9. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),
10. 11881463 - Coreless organic packages with embedded die and magnetic inductor structures (2024-01-23),
11. 11862552 - Methods of embedding magnetic structures in substrates (2024-01-02),
12. 11842981 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2023-12-12),
13. 11776864 - Corner guard for improved electroplated first level interconnect bump height range (2023-10-03),
14. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),
15. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),

Title: Innovator Spotlight: Rahul Jain from Gilbert, AZ

Introduction:

Rahul Jain from Gilbert, AZ, is a remarkable inventor with a passion for technological advancements. With 37 patents to his name, Rahul is a driving force in the field of innovation.

Latest Patents:

Rahul's recent patents highlight his ingenuity and expertise in the industry. One of his innovations is the "Package with underfill containment barrier," featuring a substrate with a raised barrier containing electroplated metal. Another groundbreaking invention is the "Substrate assembly with encapsulated magnetic feature," revolutionizing inductor technology.

Career Highlights:

Rahul Jain is a valued member of Intel Corporation, where his innovative spirit thrives. His contributions have significantly impacted the company's technological advancements and product development strategies.

Collaborations:

In his professional journey, Rahul has collaborated with esteemed coworkers such as Sai Vadlamani and Kyu Oh Lee. Together, they have worked on cutting-edge projects, pushing the boundaries of technological innovation.

Conclusion:

Rahul Jain's dedication to driving technological progress through his patented inventions is truly inspiring. His expertise, coupled with his collaborative spirit, continues to shape the landscape of innovation. Gilbert, AZ, is indeed fortunate to have such a visionary inventor in its midst.

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