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Gilbert, AZ, United States of America

Rahul Jain

USPTO Granted Patents = 44 (Patent Applications = 18)

CIPO Patents = 1 (Patent Applications = 2)

EPO Patents = 1 (Patent Applications = 9)

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 28(Granted Patents)

Location History:

Gilbert, AZ (US) (2017 - 2024)
Chandler, AZ (US) (2019 - 2024)

Company Filing History:

43 out of 54,664

Intel Corporation

where one patent can have more than one assignee

Years Active: 2017-2025

where 'Filed Patents' based on already Granted Patents

44 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12362250 - Protruding SN substrate features for epoxy flow control (2025-07-15),

2. 12334453 - Soldered metallic reservoirs for enhanced transient and steady-state thermal performance (2025-06-17),

3. 12334447 - Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) (2025-06-17),

4. 12327773 - Package with underfill containment barrier (2025-06-10),

5. 12224264 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2025-02-11),

6. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),

7. 12009271 - Protruding SN substrate features for epoxy flow control (2024-06-11),

8. 11935805 - Package with underfill containment barrier (2024-03-19),

9. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),

10. 11881463 - Coreless organic packages with embedded die and magnetic inductor structures (2024-01-23),

11. 11862552 - Methods of embedding magnetic structures in substrates (2024-01-02),

12. 11842981 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2023-12-12),

13. 11776864 - Corner guard for improved electroplated first level interconnect bump height range (2023-10-03),

14. 11737208 - Microelectronic assemblies having conductive structures with different thicknesses (2023-08-22),

15. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),

Title: Innovator Spotlight: Rahul Jain from Gilbert, AZ

Introduction:

Rahul Jain from Gilbert, AZ, is a remarkable inventor with a passion for technological advancements. With 37 patents to his name, Rahul is a driving force in the field of innovation.

Latest Patents:

Rahul's recent patents highlight his ingenuity and expertise in the industry. One of his innovations is the "Package with underfill containment barrier," featuring a substrate with a raised barrier containing electroplated metal. Another groundbreaking invention is the "Substrate assembly with encapsulated magnetic feature," revolutionizing inductor technology.

Career Highlights:

Rahul Jain is a valued member of Intel Corporation, where his innovative spirit thrives. His contributions have significantly impacted the company's technological advancements and product development strategies.

Collaborations:

In his professional journey, Rahul has collaborated with esteemed coworkers such as Sai Vadlamani and Kyu Oh Lee. Together, they have worked on cutting-edge projects, pushing the boundaries of technological innovation.

Conclusion:

Rahul Jain's dedication to driving technological progress through his patented inventions is truly inspiring. His expertise, coupled with his collaborative spirit, continues to shape the landscape of innovation. Gilbert, AZ, is indeed fortunate to have such a visionary inventor in its midst.

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