The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Jun. 28, 2022
Intel Corporation, Santa Clara, CA (US);
Cheng Xu, Chandler, AZ (US);
Kyu-Oh Lee, Chandler, AZ (US);
Junnan Zhao, Gilbert, AZ (US);
Rahul Jain, Gilbert, AZ (US);
Ji Yong Park, Chandler, AZ (US);
Sai Vadlamani, Gilbert, AZ (US);
Seo Young Kim, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.