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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Kyu-Oh Lee

This inventor holds 20 USPTO granted patents and 6 published patent applications and 4 EPO patents, primarily in Magnetic Materials. Top assignees: Intel Corporation, Senju Metal Industry Co., Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kyu-Oh Lee. Retrieved from https://idiyas.com/inventor/kyu-oh-lee-bp11yq31

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:

goldMedal19 out of 56,394 
 
Intel Corporation
 patents
silverMedal1 out of 338 
 
Senju Metal Industry Co., Ltd.
 patents

Years Active: 2018-2026

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Areas of Expertise:
Magnetic Material
Thermal Management
Integrated Circuit
Semiconductor Package
Heat Conduction
Passivation Structures
Substrate Assembly
Phase Change Material
Lead-Free Solder
Microelectronic Structures
Recessed Conductive Contacts
Dielectric Structure
20 patents (USPTO):Explore Patents
1. 12555714 - Device, method, and system to provide passivation structures of a magnetic material based inductor (2026-02-17),
2. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),
3. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),
4. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),
5. 11581271 - Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate (2023-02-14),
6. 11502017 - Effective heat conduction from hotspot to heat spreader through package substrate (2022-11-15),
7. 11482471 - Thermal management solutions for integrated circuit packages (2022-10-25),
8. 11450471 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2022-09-20),
9. 11443892 - Substrate assembly with encapsulated magnetic feature (2022-09-13),
10. 11432405 - Methods for attaching large components in a package substrate for advanced power delivery (2022-08-30),
11. 11417614 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2022-08-16),
12. 11387224 - Phase change material in substrate cavity (2022-07-12),
13. 11355459 - Embedding magnetic material, in a cored or coreless semiconductor package (2022-06-07),
14. 10468352 - Semiconductor packages with embedded bridge interconnects (2019-11-05),
15. 10446500 - Semiconductor packages with embedded bridge interconnects (2019-10-15),

Title: Innovator Spotlight: Kyu-Oh Lee - Pioneering Magnetic Technologies

Introduction:

Kyu-Oh Lee, a brilliant inventor based in Chandler, Arizona, has made significant contributions to the field of electronic components with a total of 18 patents to his name. His innovative work in the realm of substrate assemblies and magnetic materials has earned him recognition in the technology sector.

Latest Patents:

Lee's recent patents showcase his expertise in developing cutting-edge technologies. One of his latest inventions is the "Substrate assembly with encapsulated magnetic feature," a revolutionary apparatus designed for inductors. This substrate assembly features a base substrate, an encapsulated magnetic feature, and a coil, enhancing the efficiency and functionality of the inductor. Additionally, Lee's work on "Methods to embed magnetic material as the first layer on coreless substrates and corresponding structures" demonstrates his commitment to advancing electronic packaging techniques, showcasing layers of dielectric and magnetic materials in electronic packages.

Career Highlights:

Having worked at prestigious companies such as Intel Corporation, Kyu-Oh Lee has honed his skills and expertise in the technological domain. During his tenure at Intel, he has been instrumental in driving innovation and pushing the boundaries of electronic design and manufacturing processes.

Collaborations:

Lee has collaborated with esteemed colleagues in his professional journey, including Cheng Xu and Junnan Zhao. Together, they have pooled their knowledge and skills to create groundbreaking technologies, further solidifying Lee's reputation as a pioneer in the field of electronic components.

Conclusion:

In conclusion, Kyu-Oh Lee's relentless pursuit of innovation and his invaluable contributions to the realm of electronic components have cemented his position as a visionary inventor. His patented inventions and collaborative efforts underscore his dedication to pushing the boundaries of technological advancement, leaving a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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