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For the Inventor, By the Inventor

Tokyo, Japan

Senju Metal Industry Co., Ltd.


USPTO Granted Patents = 338



Trademarks = 27

Forward Citations = 1,052

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358 inventors (with patents filed for the assignee):

goldMedal Hiroyoshi Kawasaki (49 out of 50 patents)

silverMedal Minoru Ueshima (35 out of 35 patents)

bronzeMedal Shunsaku Yoshikawa (32 out of 32 patents)

4.  Takahiro Roppongi (24 out of 24 patents)

5.  Daisuke Soma (23 out of 23 patents)

6.  Isamu Sato (22 out of 64 patents)

7.  Kaichi Tsuruta (20 out of 20 patents)

8.  Yuji Kawamata (18 out of 21 patents)

9.  Tsukasa Ohnishi (18 out of 20 patents)

10.  Masato Shiratori (17 out of 17 patents)

11.  Tsutomu Hiyama (15 out of 15 patents)

12.  Toshihiko Taguchi (13 out of 18 patents)

13.  Hiroshi Okada (12 out of 83 patents)

14.  Yoshie Tachibana (12 out of 12 patents)

15.  Takashi Saito (12 out of 74 patents)


Core Competencies:
Solder Paste
Lead-Free Solder Alloy
Solder Joint
Flux Recovery Device
Soldering Apparatus
Layered Bonding Material
Resin-Cored Solder
Copper-Silver Alloy
Electronic Circuit
Flux Composition
Solder Ball
Power Module

338 patents:

1. 12515282 - Flux and method for producing electronic component (2026-01-06),
2. 12515281 - Flux (2026-01-06),
3. 12502735 - Flux and solder paste (2025-12-23),
4. 12479051 - Flux and solder paste (2025-11-25),
5. 12459060 - Solder paste (2025-11-04),
6. 12447565 - Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint (2025-10-21),
7. 12447564 - Solder alloy, solder ball, and solder joint (2025-10-21),
8. 12434316 - Soldering apparatus (2025-10-07),
9. 12427607 - Flux and solder paste (2025-09-30),
10. 12409409 - Condensation device, flux recovery device, soldering device, water vapor removing method, flux recovery method and solder processing method (2025-09-09),
11. 12383987 - Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint (2025-08-12),
12. 12377500 - Lead-free and antimony-free solder alloy, solder ball, and solder joint (2025-08-05),
13. 12365054 - Flux and solder paste (2025-07-22),
14. 12330244 - Flux, solder paste, and method for producing bonded body (2025-06-17),
15. 12304008 - Flux and method for producing assembly (2025-05-20),
Senju Metal Industry Co., Ltd. is a leading global manufacturer of soldering materials, providing advanced solutions to various industries. With over 90 years of experience in the field, Senju Metal offers a wide range of high-quality solder pastes, fluxes, and other soldering-related products. Their innovative solutions are trusted by electronic manufacturers worldwide for their reliability, efficiency, and environmental sustainability. Visit their website for more details and to explore their comprehensive range of soldering products.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

338 Patents

#220 in Tokyo

#479 in Japan

#2,603 in the World

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Tokyo, Japan

Senju Metal Industry Co., Ltd.

Forward Citations = 1,052

358 inventors:

goldMedal Hiroyoshi Kawasaki (49 out of 50 patents)

silverMedal Minoru Ueshima (35 out of 35 patents)

bronzeMedal Shunsaku Yoshikawa (32 out of 32 patents)

4.  Takahiro Roppongi (24 out of 24 patents)

5.  Daisuke Soma (23 out of 23 patents)

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