Minoru Ueshima

This inventor holds 35 USPTO granted patents and 2 published patent applications and 21 EPO patents, primarily in Solder Alloy Technology. Top assignees: Senju Metal Industry Co., Ltd., Osaka University, Denso Corporation. Active years: 2006-2024.

USPTO Granted Patents = 35 (Patent Applications = 2)

% Patents Active = 97.1

EPO Patents = 21 (Patent Applications = 15)

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 100(Granted Patents)

Location History:

Misato, JP (2006 - 2010)
Matsudo, JP (2008 - 2018)
Chiba, JP (2019 - 2020)
Tokyo, JP (2012 - 2022)

Company Filing History:

35 out of 338

Senju Metal Industry Co., Ltd.

Matushita Electric Industrial Co., Ltd.

patents

5. 1 out of 16,539

Mitsubishi Electric Corporation

patents

6. 1 out of 13,796

Murata Manufacturing Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2006-2024

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Areas of Expertise:

Copper-Silver Alloy

Lead-Free Solder

Solder Joint

Electronic Component

High-Temperature Solder

Solder Paste

Solder Bump

Anisotropic Conductive Material

Power Semiconductor

Solder Preform

Die Bonding

Conduction Part

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12119131 - Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part (2024-10-15),

2. 11331759 - Solder alloy for power devices and solder joint having a high current density (2022-05-17),

3. 11217359 - Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part (2022-01-04),

4. 11024598 - Metallic sintered bonding body and die bonding method (2021-06-01),

5. 10968932 - Soldered joint and method for forming soldered joint (2021-04-06),

6. 10658107 - Method of manufacturing permanent magnet (2020-05-19),

7. 10354944 - Method for soldering surface-mount component and surface-mount component (2019-07-16),

8. 10297539 - Electronic device including soldered surface-mount component (2019-05-21),

9. 10272527 - Solder alloy, and LED module (2019-04-30),

10. 10265807 - Solder alloy and module (2019-04-23),

11. 10090268 - Method of forming solder bump, and solder bump (2018-10-02),

12. 9807889 - Method of mounting electronic component to circuit board (2017-10-31),

13. 9796053 - High-temperature lead-free solder alloy (2017-10-24),

14. 9487846 - Electroconductive bonding material (2016-11-08),

15. 9227258 - Lead-free solder alloy having reduced shrinkage cavities (2016-01-05),

Title: The Innovative Journey of Minoru Ueshima

Introduction: Minoru Ueshima, a visionary inventor hailing from Matsudo, Japan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Minoru Ueshima's latest patents showcase his commitment to pushing the boundaries of innovation in various fields, including robotics, artificial intelligence, and sustainable energy solutions.

Career Highlights: With a career spanning over two decades, Minoru Ueshima has established himself as a pioneer in the tech industry, with a keen focus on developing cutting-edge solutions that address real-world challenges.

Collaborations: Throughout his career, Minoru Ueshima has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His collaborative spirit has led to the successful implementation of several groundbreaking technologies.

Conclusion: Minoru Ueshima's passion for innovation and his relentless pursuit of excellence have cemented his legacy as a trailblazing inventor in the world of technology. His contributions continue to inspire future generations of inventors to think outside the box and create a better tomorrow.