Senju Metal Industry Co., Ltd.

Osaka University

Denso Corporation

Mitsubishi Electric Corporation

Murata Manufacturing Co., Ltd.

Matushita Electric Industrial Co., Ltd.

Panasonic Corporation

Minoru Ueshima

Tsukasa Ohnishi

Yoshitaka Toyoda

Osamu Munekata

Rei Fujimaki

Takeshi Sakamoto

Katsuaki Suganuma

Yuji Kawamata

Minoru Toyoda

Hiroshi Okada

Hidekiyo Takaoka

Masazumi Amagai

Yoshie Tachibana

Jinting Jiu

Masako Watanabe

Kensho Murata

Masayuki A Suzuki

Min Woo Kang

Shunsaku Yoshikawa

Tomomi Okumura

Takahiro Roppongi

Kosuke Nakano

Kaichi Tsuruta

Naohiko Hirano

Yoshitsugu Sakamoto

Klaus Wilke

Takashi Akagawa

Yoshie Yamanaka

Shinji Fukumoto

Yasuyuki Sekimoto

Tetsu Takemasa

Daisuke Souma

Hans-Jurgen Albrecht

Seiki Suzuki

Takashi Ishii

Kazuhiro Matsushita

Wanli Li

Tomu Tamura

Masashi Sakamoto

Haruo Suzuki

Kozo Fujimoto

Tokuro Yamaki

Shigeo Nishimura

Satoshi Watanabe

Michiya Matsushima

Takeshi Kan

Shu Inoue

Isamu Osawa

Kayako Nakagawa

Yasuaki Kokubu

Daisuke Sakuma

Yoshimi Inagawa

Kazuaki Haga

Takaaki Takahashi

Hiroshi Nishibori

Kunihiro Yoshihara

Hideki Tokimoto

Masayuki Ojima

Tohru Kurushima

Hirofumi Nogami

Norihisa Eguchi

Takeshi Tashima

Ippei Akagi

Masahumi Seino

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn&#x2014;Ag&#x2014;Bi&#x2014;In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.

Solder alloy for power devices and solder joint having a high current density

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 &#x3bc;m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 &#x3bc;m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.

Metallic sintered bonding body and die bonding method

A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn&#x2014;Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn&#x2014;Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn&#x2014;Sb intermetallic compound phase and the substrate-side intermetallic compound layer.

Soldered joint and method for forming soldered joint

In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.

Method of manufacturing permanent magnet

A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn&#x2014;Sb)-based solder material having high melting point, the (Sn&#x2014;Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn&#x2014;Ag&#x2014;Cu&#x2014;Bi)-based solder material or (Sn&#x2014;Ag&#x2014;Cu&#x2014;Bi&#x2014;In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Method for soldering surface-mount component and surface-mount component

The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn&#x2014;Sb)-based solder material having high melting point as the solder material for die pad, the (Sn&#x2014;Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn&#x2014;Ag&#x2014;Cu&#x2014;Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Electronic device including soldered surface-mount component

Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Solder alloy, and LED module

Solder alloy and module

A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

Method of forming solder bump, and solder bump

An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

Method of mounting electronic component to circuit board

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250&#xb0; C. In order to make the structure of an Sn&#x2014;Sb&#x2014;Ag&#x2014;Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

High-temperature lead-free solder alloy

An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1-15%, In: 2-16%, Sb: greater than 0% to at most 2%, optionally one or both of Ag: at most 2% and Cu: at most 1%, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01-0.15%, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.

Electroconductive bonding material

A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.

Lead-free solder alloy having reduced shrinkage cavities

Growing community of inventors

Matsudo, Japan

Minoru Ueshima