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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9796053 B1

PDFFull Text
Date of Patent:
Oct. 24, 2017

Filed:

Jul. 29, 2013

High-temperature lead-free solder alloy

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Rei Fujimaki, Tokyo, JP;

Minoru Ueshima, Tokyo, JP;

Assignee:

SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;

Attorney:

Young & Thompson

Primary Examiner:

Roy King

Assistant Examiner:

Caitlin Kiechle

Int. Cl.
CPC ...
B23K 35/28 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); C22C 30/06 (2006.01); B23K 35/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); C22C 12/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/28 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01); H05K 3/3463 (2013.01); B23K 2201/40 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); Y10T 403/479 (2015.01);
Abstract

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

Find Patent Forward Citations

Fujimaki, Rei. (2017). High-temperature lead-free solder alloy (U.S. Patent No. 9796053). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9796053

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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