Tokyo, Japan

Rei Fujimaki

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Koshigaya, JP (2014)
  • Tokyo, JP (2017 - 2019)

Company Filing History:


Years Active: 2014-2019

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6 patents (USPTO):Explore Patents

Title: The Innovations of Rei Fujimaki: A Pioneer in Solder Alloys

Introduction: Rei Fujimaki is an accomplished inventor based in Tokyo, Japan, known for his significant contributions to the field of solder alloys. With a total of six patents to his name, Fujimaki has made substantial advancements that enhance the durability and effectiveness of soldering materials, particularly in the electronics industry.

Latest Patents: Fujimaki's latest patents focus on the development of advanced lead-free solder alloys. One notable patent is for a lead-free solder alloy that boasts excellent tensile strength and ductility. This innovative alloy does not deform after heat cycles and is resistant to cracking. Its optimized In and Bi content, along with adjusted Sb and Ni levels, results in a composition containing, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder being Sn.

Additionally, he has developed a specialized solder alloy suitable for soldering LED modules, which incorporates an aluminum substrate into its composition. This patented alloy consists of 3-10% Sb, 0-4% Ag, and 0.3-1.2% Cu, with the remainder consisting of Sn. The innovative design also allows for a minimal inclusion of other elements, ensuring superior performance and reliability in various applications.

Career Highlights: Rei Fujimaki currently works for Senju Metal Industry Co., Ltd., a company recognized for its excellence in metal products and soldering materials. Throughout his career, he has focused on developing materials that meet the rigorous demands of modern technology, laying the groundwork for future innovations in soldering techniques.

Collaborations: Fujimaki has worked alongside notable colleagues such as Minoru Ueshima and Shunsaku Yoshikawa. Their collaborative efforts exemplify the spirit of teamwork in innovation, driving advancements in materials science and electronics.

Conclusion: Rei Fujimaki's contributions to the field of solder alloys not only demonstrate his ingenuity as an inventor but also his commitment to enhancing industry standards. With his ongoing work, the future of soldering materials looks promising, paving the way for more sustainable and effective solutions in electronics and beyond.

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