The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Dec. 25, 2012
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Tsukasa Ohnishi, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Seiko Ishibashi, Tokyo, JP;
Rei Fujimaki, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 3/34 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); B23K 35/02 (2006.01); H01L 27/00 (2006.01); H05K 1/02 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0233 (2013.01); B23K 35/0244 (2013.01); C22C 13/00 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 27/00 (2013.01); H05K 1/0203 (2013.01); H05K 3/3463 (2013.01); H01L 23/552 (2013.01); H01L 2924/0002 (2013.01); H05K 3/341 (2013.01); H05K 2201/10371 (2013.01);
Abstract
Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.