Tokyo, Japan

Tsukasa Ohnishi

USPTO Granted Patents = 20 

 

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 132(Granted Patents)


Location History:

  • Souka, JP (2006 - 2010)
  • Koshigaya, JP (2014 - 2015)
  • Sapporo, JP (2015)
  • Tokyo, JP (1996 - 2018)

Company Filing History:


Years Active: 1996-2018

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20 patents (USPTO):

Title: Tsukasa Ohnishi: A Pioneer in Lead-Free Solder Alloy Innovations

Introduction

Tsukasa Ohnishi, based in Tokyo, Japan, has made significant contributions to the field of material science, particularly in the development of lead-free solder alloys. With an impressive portfolio of 20 patents, he stands out as an innovative thinker and inventor in the electronics industry.

Latest Patents

Among his latest patents, Tsukasa Ohnishi has developed a Sn-Cu-based lead-free solder alloy, which demonstrates excellent wettability on both copper (Cu) and nickel (Ni) surfaces. This alloy comprises 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of aluminum (Al), with optional additions of titanium (Ti) and cobalt (Co), making the remainder primarily tin (Sn). In addition, he has patented a lead-free solder alloy designed to minimize electromigration and resistance increases during high current density electric conduction. This specific alloy consists of 1.0-13.0 mass % of indium (In), 0.1-4.0 mass % of silver (Ag), and 0.3-1.0 mass % of copper (Cu), with the remaining composition being tin (Sn). The exceptional tensile properties of this alloy, even at temperatures exceeding 100°C, render it suitable for both CPUs and power semiconductors.

Career Highlights

Tsukasa Ohnishi has spent a considerable portion of his career with notable companies, including Senju Metal Industry Co., Ltd. and Mayo Foundation for Medical Education and Research. His work has primarily focused on enhancing solder materials, which play a crucial role in the reliability and performance of electronic devices.

Collaborations

Throughout his professional journey, Tsukasa Ohnishi has collaborated with distinguished colleagues such as Yoshie Yamanaka and Shunsaku Yoshikawa. These partnerships have facilitated significant advancements in solder technology, contributing to his success as an inventor.

Conclusion

With 20 patents to his name, Tsukasa Ohnishi has established himself as a trailblazer in the development of lead-free solder alloys. His innovative approach addresses critical challenges in the electronics industry, making him a key player in the advancement of reliable solder materials. His continued work promises to influence future technologies, showcasing the importance of innovation in modern manufacturing processes.

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