The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Apr. 09, 2012
Applicants:
Seiko Ishibashi, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Tsukasa Ohnishi, Sapporo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); B23K 35/26 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); B23K 35/02 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/025 (2013.01); B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 1/203 (2013.01); H05K 3/3463 (2013.01); B23K 2201/36 (2013.01);
Abstract
A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.