The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Mar. 23, 2012
Masato Shimamura, Tokyo, JP;
Tsukasa Ohnishi, Tokyo, JP;
Mitsuhiro Kosai, Tokyo, JP;
Kazuyori Takagi, Tokyo, JP;
Tomoko Nonaka, Tokyo, JP;
Masayuki Suzuki, Tokyo, JP;
Toru Hayashida, Tokyo, JP;
Seiko Ishibashi, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Yoshie Yamanaka, Tokyo, JP;
Masato Shimamura, Tokyo, JP;
Tsukasa Ohnishi, Tokyo, JP;
Mitsuhiro Kosai, Tokyo, JP;
Kazuyori Takagi, Tokyo, JP;
Tomoko Nonaka, Tokyo, JP;
Masayuki Suzuki, Tokyo, JP;
Toru Hayashida, Tokyo, JP;
Seiko Ishibashi, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Yoshie Yamanaka, Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.