The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Apr. 15, 2004
Masazumi Amagai, Tsukuba, JP;
Masako Watanabe, Oita, JP;
Kensho Murata, Beppu, JP;
Yoshitaka Toyoda, Satte, JP;
Minoru Ueshima, Misato, JP;
Tsukasa Ohnishi, Souka, JP;
Takeshi Tashima, Ohnojo, JP;
Daisuke Souma, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Hiroshi Okada, Souka, JP;
Masazumi Amagai, Tsukuba, JP;
Masako Watanabe, Oita, JP;
Kensho Murata, Beppu, JP;
Yoshitaka Toyoda, Satte, JP;
Minoru Ueshima, Misato, JP;
Tsukasa Ohnishi, Souka, JP;
Takeshi Tashima, Ohnojo, JP;
Daisuke Souma, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Hiroshi Okada, Souka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.