Tochigi, Japan

Takahiro Roppongi

USPTO Granted Patents = 24 

 

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 52(Granted Patents)


Location History:

  • Utsunomiya, JP (2002 - 2015)
  • Tochigi-ken, JP (2016 - 2019)
  • Tochigi, JP (2006 - 2021)
  • Tokyo, JP (2022)

Company Filing History:


Years Active: 2002-2022

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24 patents (USPTO):

Title: Takahiro Roppongi: A Pioneer in Solder Material Innovations

Introduction

Takahiro Roppongi is a distinguished inventor based in Tochigi, Japan, known for his significant contributions to the field of solder materials. With an impressive portfolio of 24 patents, Roppongi continues to drive innovations that enhance the efficiency and reliability of electronic components.

Latest Patents

Among his recent patents, Roppongi has developed innovative solder materials that include unique properties and formulations. One notable patent focuses on a solder material containing Sn or a Sn-containing alloy with specific concentrations of additives, designed to form an As-enriched layer. Another of his patents describes a soldering material that distinguishes itself by being less prone to oxidation. His Cu core ball invention features a copper ball of predetermined size, coated with a solder layer, establishing critical space in applications between semiconductor packages and printed circuit boards. These soldering materials exhibit remarkable color characteristics even after undergoing rigorous heating storage tests, demonstrating Roppongi's commitment to advancing solder technology.

Career Highlights

Roppongi has achieved recognition through his extensive research and development at Senju Metal Industry Co., Ltd. His expertise in solder materials has resulted in groundbreaking patents that are crucial for the electronics manufacturing industry. His work consistently emphasizes enhancing performance and reliability in soldering applications, cementing his reputation as an innovator in the engineering domain.

Collaborations

Throughout his career, Roppongi has collaborated with talented individuals such as Daisuke Soma and Hiroyoshi Kawasaki, leveraging their collective skills and knowledge to push the boundaries of solder material development. These collaborations have further contributed to the successful innovation of products that meet industry standards and respond to market needs.

Conclusion

Takahiro Roppongi stands out as a key figure in the advancement of solder materials, with a robust collection of patents that illustrate his innovative spirit. His dedication to developing solutions that address challenges in the electronics industry ensures that his work will have a lasting impact for years to come.

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