This inventor holds 24 USPTO granted patents and 4 published patent applications and 8 EPO patents, primarily in Solder Materials. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2002-2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Utsunomiya, JP (2002 - 2015)
- Tochigi-ken, JP (2016 - 2019)
- Tochigi, JP (2006 - 2021)
- Tokyo, JP (2022)
Company Filing History:
Years Active: 2002-2022
Areas of Expertise:
Title: Takahiro Roppongi: A Pioneer in Solder Material Innovations
Introduction
Takahiro Roppongi is a distinguished inventor based in Tochigi, Japan, known for his significant contributions to the field of solder materials. With an impressive portfolio of 24 patents, Roppongi continues to drive innovations that enhance the efficiency and reliability of electronic components.
Latest Patents
Among his recent patents, Roppongi has developed innovative solder materials that include unique properties and formulations. One notable patent focuses on a solder material containing Sn or a Sn-containing alloy with specific concentrations of additives, designed to form an As-enriched layer. Another of his patents describes a soldering material that distinguishes itself by being less prone to oxidation. His Cu core ball invention features a copper ball of predetermined size, coated with a solder layer, establishing critical space in applications between semiconductor packages and printed circuit boards. These soldering materials exhibit remarkable color characteristics even after undergoing rigorous heating storage tests, demonstrating Roppongi's commitment to advancing solder technology.
Career Highlights
Roppongi has achieved recognition through his extensive research and development at Senju Metal Industry Co., Ltd. His expertise in solder materials has resulted in groundbreaking patents that are crucial for the electronics manufacturing industry. His work consistently emphasizes enhancing performance and reliability in soldering applications, cementing his reputation as an innovator in the engineering domain.
Collaborations
Throughout his career, Roppongi has collaborated with talented individuals such as Daisuke Soma and Hiroyoshi Kawasaki, leveraging their collective skills and knowledge to push the boundaries of solder material development. These collaborations have further contributed to the successful innovation of products that meet industry standards and respond to market needs.
Conclusion
Takahiro Roppongi stands out as a key figure in the advancement of solder materials, with a robust collection of patents that illustrate his innovative spirit. His dedication to developing solutions that address challenges in the electronics industry ensures that his work will have a lasting impact for years to come.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile