The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Nov. 05, 2014
Senju Metal Industry Co., Ltd., Tokyo, JP;
Takahiro Hattori, Tochigi, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Hiroshi Okada, Shanghai, CN;
Takahiro Roppongi, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Isamu Sato, Saitama, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ballA is provided with a Cu ballA for keeping a space between a semiconductor package and a printed circuit board and a solder layerA that covers the Cu ballA. The solder layerA is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ballA, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.