Tokyo, Japan

Isamu Sato

USPTO Granted Patents = 64 

 

Average Co-Inventor Count = 3.6

ph-index = 12

Forward Citations = 547(Granted Patents)


Inventors with similar research interests:


Location History:

  • Nerima-ku, JP (2004)
  • Souka, JP (2010)
  • Saitama-ken, JP (2016 - 2019)
  • Tochigi, JP (2019)
  • Tokyo, JP (2000 - 2020)
  • Saitama, JP (2017 - 2021)

Company Filing History:


Years Active: 2000-2021

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64 patents (USPTO):

Title: Isamu Sato: Innovator in Soldering Materials and Technology

Introduction

Isamu Sato, a prolific inventor based in Tokyo, Japan, has made significant contributions to the field of soldering materials through his extensive portfolio of 64 patents. His innovative work has paved the way for advancements in electronic assembly and semiconductor packaging.

Latest Patents

One of Sato's notable inventions is a soldering material that minimizes oxidation. This invention features a copper (Cu) core ball with a specific size that is coated with a solder layer. The design provides ample space between a semiconductor package and a printed circuit board. It's noteworthy that the Cu core ball exhibits a lightness greater than 62.5 in the L*a*b* color space after undergoing a heating storage test at 150°C for 72 hours, maintaining its characteristics even in humidity. Another impactful patent describes a Cu column and a solder joint characterized by low Vickers hardness and minimal arithmetic mean roughness, making it particularly suitable for three-dimensional mounting and pitch narrowing applications. The Cu column boasts a purity range of 99.9% to 99.995%, ensuring high-performance standards in various electronic applications.

Career Highlights

Throughout his career, Sato has been affiliated with prominent companies, including TDK Corporation and Senju Metal Industry Co., Ltd. His contributions to the industry have solidified his reputation as an expert in materials science and electronic engineering.

Collaborations

Sato has collaborated with notable colleagues such as Takahiro Roppongi and Daisuke Soma. Working together, they have combined their expertise to drive innovation and overcome complex challenges in the development of soldering technologies.

Conclusion

Isamu Sato's impressive portfolio of patents demonstrates his unwavering commitment to innovation in soldering materials. His work continues to influence the electronic industry, making significant strides in the reliability and efficiency of electronic components. As he moves forward in his career, Sato's future inventions are sure to set new standards in technology and materials science.

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