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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10322472 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Nov. 04, 2014

Cu core ball, solder paste, formed solder, cu core column, and solder joint

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Takahiro Hattori, Tochigi, JP;

Daisuke Soma, Tochigi, JP;

Takahiro Roppongi, Tochigi, JP;

Isamu Sato, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Erin B Saad

Assistant Examiner:

Carlos J Gamino

Int. Cl.
CPC ...
C22C 13/02 (2006.01); B23K 35/30 (2006.01); B22F 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/22 (2006.01); C22C 13/00 (2006.01); B22F 1/02 (2006.01); C22C 1/04 (2006.01); H01L 23/00 (2006.01); C25D 3/60 (2006.01); H01L 23/556 (2006.01); C25D 7/00 (2006.01); B23K 35/02 (2006.01); C22C 9/00 (2006.01); C23C 28/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/302 (2013.01); B22F 1/00 (2013.01); B22F 1/025 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/22 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 1/0483 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C23C 28/021 (2013.01); C25D 3/60 (2013.01); C25D 7/00 (2013.01); H01L 23/556 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); B22F 1/0048 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13455 (2013.01); H01L 2224/13457 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/351 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0218 (2013.01);
Abstract

Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball () contains a Cu ball () made of Cu or a Cu alloy and a solder layer () which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (). The solder layer () contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Find Patent Forward Citations

Hattori, Takahiro. (2019). Cu core ball, solder paste, formed solder, cu core column, and solder joint (U.S. Patent No. 10322472). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10322472

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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