The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Feb. 04, 2014
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Hiroyoshi Kawasaki, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Isamu Sato, Saitama, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 9/08 (2006.01); B22F 9/14 (2006.01); B22F 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/556 (2006.01); H05K 3/34 (2006.01); B23K 35/30 (2006.01); C22C 9/00 (2006.01); C22C 19/03 (2006.01); C22F 1/08 (2006.01); C22F 1/10 (2006.01); B22F 1/02 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); B23K 101/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B22F 1/0003 (2013.01); B22F 1/0048 (2013.01); B22F 1/025 (2013.01); B22F 9/08 (2013.01); B22F 9/082 (2013.01); B22F 9/14 (2013.01); B23K 35/302 (2013.01); B23K 35/3033 (2013.01); C22C 9/00 (2013.01); C22C 19/03 (2013.01); C22F 1/08 (2013.01); C22F 1/10 (2013.01); H01L 23/556 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H05K 3/3463 (2013.01); B22F 2009/0848 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 2201/42 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/132 (2013.01); H01L 2224/133 (2013.01); H01L 2224/136 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/1317 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/1332 (2013.01); H01L 2224/1336 (2013.01); H01L 2224/1337 (2013.01); H01L 2224/1338 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13138 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13149 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13163 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13172 (2013.01); H01L 2224/13173 (2013.01); H01L 2224/13176 (2013.01); H01L 2224/13178 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13181 (2013.01); H01L 2224/13183 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/13211 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13305 (2013.01); H01L 2224/13309 (2013.01); H01L 2224/13317 (2013.01); H01L 2224/13318 (2013.01); H01L 2224/13323 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13338 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13349 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13357 (2013.01); H01L 2224/13363 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/13366 (2013.01); H01L 2224/13369 (2013.01); H01L 2224/13371 (2013.01); H01L 2224/13372 (2013.01); H01L 2224/13373 (2013.01); H01L 2224/13376 (2013.01); H01L 2224/13378 (2013.01); H01L 2224/13379 (2013.01); H01L 2224/13381 (2013.01); H01L 2224/13383 (2013.01); H01L 2224/13384 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81011 (2013.01); H01L 2924/381 (2013.01); H01L 2924/3841 (2013.01); H05K 3/3436 (2013.01); H05K 2203/041 (2013.01);
Abstract
Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.