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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10147695 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Jun. 19, 2013

Cu core ball

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyoshi Kawasaki, Tochigi, JP;

Tomohiko Hashimoto, Tochigi, JP;

Atsushi Ikeda, Tochigi, JP;

Takahiro Roppongi, Tochigi, JP;

Daisuke Soma, Tochigi, JP;

Isamu Sato, Saitama, JP;

Yuji Kawamata, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Weiping Zhu

Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01L 23/556 (2006.01); B22F 1/02 (2006.01); H01L 23/498 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); C22C 9/00 (2006.01); C22C 43/00 (2006.01); C23C 28/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B22F 1/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C22C 43/00 (2013.01); C23C 28/021 (2013.01); H01L 23/49816 (2013.01); H01L 23/556 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 2224/111 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3841 (2013.01); H05K 3/3457 (2013.01); H05K 2203/041 (2013.01);
Abstract

A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an α dose of 0.0200 cph/cmor less.

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