Tdk Corporation

Senju Metal Industry Co., Ltd.

Kabushiki Kaisha Toshiba

Stanley Electric Co., Ltd

Isamu Sato

Takahiro Roppongi

Daisuke Soma

Hiroyoshi Kawasaki

Rachid Sbiaa

Tsutomu Aoyama

Hiroshi Ikeda

Tetsuya Roppongi

Haruyuki Morita

Yuji Kawamata

Takahiro Hattori

Takeshi Wada

Yoshikazu Soeno

Kiyoshi Noguchi

Mikio Matsuzaki

Noboru Yamanaka

Takuya Adachi

Yoshimitsu Wada

Atsushi Ikeda

Masashi Shiraishi

Masanori Sakai

Kenichi Takano

Tsuyoshi Umehara

Shigeki Kondo

Izumi Nomura

Takashi Hagiwara

Takashi Akagawa

Saori Kajihara

Yuichi Koikeda

Masaru Sasaki

Tomoaki Nishino

Koji Shimazawa

Tomoyuki Sasaki

Kei Hirata

Hideki Nakamura

Hiroshi Okada

Koji Watanabe

Norikazu Ota

Satoru Araki

Koichi Terunuma

Kazuhiro Hattori

Naoki Hanashima

Susumu Haratani

Hiroyuki Yamasaki

Taro Oike

Shinichi Nomoto

Kaichi Tsuruta

Yuichi Watabe

Shinya Omori

Issaku Sato

Yoshifumi Takao

Takamitsu Tsuna

Masaaki Muto

Hiroki Sudo

Akira Takaguchi

Takashi Nauchi

Shinji Ichikawa

Toshiyuki Nagahara

Daisuke Souma

Naoto Kameda

Yasuhisa Yaguchi

Atsumi Takahashi

Daisuke Maruko

Kota Kikuchi

Michio Suzuki

Naoyuki Matsubara

Hiroharu Shimada

Kazuo Fujikura

Shigeru Shibayama

Tomohiko Hashimoto

Takafumi Sano

Naoyuki Motozawa

Kazuhiko Matsui

Kazuya Higashi

Tomofumi Kaneko

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150&#xb0; C. with a temperature of 25&#xb0; C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Soldering material

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 &#x3bc;m, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

Cu column, Cu core column, solder joint, and through-silicon via

To provide a container and a package configured to prevent a deformation of housed metal. According to one aspect of the present invention, there is provided the container. This container includes a cylindrical container body, a lid, and a flat plate-shaped inner plug. The cylindrical container body with a bottom has a sidewall and a bottom wall. The lid has a flat plate portion and a side portion. The flat plate portion covers an opening of the container body. The side portion covers at least a part of an outer peripheral surface of the container body. The flat plate-shaped inner plug is located inside the lid. The container body includes a thread ridge on the outer peripheral surface. The side portion of the lid has a screw groove with two or more threads on its inner peripheral surface. The lid is configured to be screwed with the container body by screwing the screw groove with the thread ridge. A plurality of lock portions are disposed on an outer periphery of the lid. The screw groove has the threads by a count identical to a count of the lock portions. The inner plug is held to an inside of the lid by each of the lock portions fitted into each inside of the screw grooves.

Container and package

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ballA is provided with a Cu ballA for keeping a space between a semiconductor package and a printed circuit board and a solder layerA that covers the Cu ballA. The solder layerA is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ballA, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 &#x3bc;m or less, and the solder material has a spherical diameter of 1 to 230 &#x3bc;m and a sphericity of 0.95 or more.

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Flux composition for solder applications

A core material including a core and a solder plating layer of a (Sn&#x2014;Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

Core material, semiconductor package, and forming method of bump electrode

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 &#x3bc;m.

Method of manufacturing cu core ball

Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball () contains a Cu ball () made of Cu or a Cu alloy and a solder layer () which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (). The solder layer () contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a SnO film is formed outside the solder layer, and a SnOfilm is formed outside the SnO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.

Solder material, solder joint, and method of manufacturing the solder material

Produced is a metal ball which suppresses an emitted &#x3b1; dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.

Method for producing metal ball, joining material, and metal ball

A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an &#x3b1; dose of 0.0200 cph/cmor less.

Cu core ball

Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic componentis constructed by joining a solder bumpof a semiconductor chipto an electrodeof a printed circuit boardwith solder paste. The solder bumpis formed by joining an electrodeof the semiconductor chipto the Cu ball. The Cu ballaccording to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.

Cu ball, Cu core ball, solder joint, solder paste, and solder foam

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few &#x3bc;m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG., this apparatus comprises a solder bathof accommodating the molten solder; a second conveying sectionfor drawing up a strip memberfrom the solder bath; and a blower sectionfor blowing hot gas on the strip memberimmediately after being drawn up from the solder bath by a second conveying section; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder. According to this configuration, the excess molten soldercan be trimmed from the strip membercorresponding to composition of the molten solder. Thus, the film thickness of the molten soldercoated on the strip membercan be controlled evenly and in increments of a few &#x3bc;m.

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic componentis constructed by joining a solder bumpof a semiconductor chipto an electrodeof a printed circuit boardwith solder paste. The solder bumpis formed by joining an electrodeof the semiconductor chipto the Ni ball. The Ni ballaccording to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

Growing community of inventors

Tokyo, Japan

Isamu Sato