The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Feb. 04, 2014
Senju Metal Industry Co., Ltd., Tokyo, JP;
Hiroyoshi Kawasaki, Tochigi, JP;
Takashi Akagawa, Tochigi, JP;
Yuichi Koikeda, Tochigi, JP;
Atsushi Ikeda, Tochigi, JP;
Masaru Sasaki, Tochigi, JP;
Takahiro Roppongi, Tochigi, JP;
Daisuke Soma, Tochigi, JP;
Isamu Sato, Saitama, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic componentis constructed by joining a solder bumpof a semiconductor chipto an electrodeof a printed circuit boardwith solder paste. The solder bumpis formed by joining an electrodeof the semiconductor chipto the Ni ball. The Ni ballaccording to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.